Tegal Corp. reported unaudited consolidated earnings results for the second quarter and six months ended September 30, 2009. Revenues for the second quarter of fiscal 2010 were $3.1 million, an increase of 55% from $2.0 million in the same period last year. Tegal reported a net loss of $1.7 million, or $0.20 per basic and diluted share, for the quarter, compared to net loss of $2.5 million, or $0.34 per basic and diluted share in the same period last year. Operating loss for the second quarter was $1.8 million, including approximately $0.4 million of non-cash charges. Operating loss in the same period last year was $2.4 million. For the six months, the company reported net loss of $4.296 million or $0.51 per basic and diluted share on revenues of $4.200 million compared to net loss of $3.290 million or $0.45 per basic and diluted share on revenues of $6.739 million for the same period of last year. The company reported loss from operations of $4.817 million compared to loss from operations of $3.415 million for the same period of last year.

Tegal Corp. announced that its full process portfolio for silicon DRIE applications has been made available for the new ProNova ICP source. The application suite includes processes for high aspect ratio DRIE under the SHARP patent, as well as well-established processes for integrated mask open and the tri-pulse process for high resist mask selectivity deep silicon etching. The ProNova ICP source is available immediately to ship on Tegal 110, 200, 3200, and 4200 DRIE Wafer Processing Systems. ProNova is also compatible as a retrofit with Tegal and AMMS DRIE systems already in the field, and ProNova supports SHARP Tegal's Super High Aspect Ratio Process, achieving etched feature aspect ratios of greater than 100:1 in production environments. In addition, all Tegal silicon DRIE systems now feature low frequency bias for notch-free silicon DRIE for SOI substrates as standard equipment.

Tegal Corp. announced it has received a repeat order for a Tegal 200 SE DRIE tool from a Japanese provider of MEMS devices. The Tegal 200 SE DRIE tool will ship in the current quarter, and will be used by the customer to rapidly increase production output of commercial MEMS products. This repeat DRIE system order for Tegal was secured as a result of the continued successful cooperation between Tegal and Canon Marketing Japan Tegal's sales partner in Japan for the Tegal DRIE product line. The Tegal 200 SE system is high-density plasma etch tool featuring an inductively coupled plasma etch reactor and magnetic plasma confinement. The tool can run Tegal's patented SHARP Super High Aspect Ratio Process, achieving etched feature aspect ratios of greater than 100:1 in production environments. Together with its high reliability, broad process windows, and high etch rates, the Tegal 200 SE system is a critical enabler for etching silicon (SE) films found in the MEMS, bio-tech, power IC, optoelectronic, and 3D-IC markets. Tegal DRIE tools are presently employed in numerous research and development laboratories throughout the world, engaging in both commercial and academic research programs, and are also found in MEMS foundries and other dedicated commercial High Volume Manufacturing lines world-wide.