Rudolph Technologies Inc. announced that Touch Micro-System Tech has reported a substantial reduction in per-wafer inspection time using Rudolph's NSX(R) Inspection System and Discover(R) Data Analysis software. Discover, which is the NSX's automated data analysis program, allows the user to rapidly identify, classify, sort and diagnose defect causes. Rudolph's NSX automated macro defect inspection tool uses image-based optical inspection technology to detect defects occurring in microelectronics manufacturing processes. It offers significant improvements in speed, accuracy, repeatability and reproducibility when compared to manual inspection procedures. Discover Data Analysis software automatically classifies detected defects based on operator defined characteristics, allowing the user to quickly direct appropriate attention to those defects with the greatest impact on process yield.

Rudolph Technologies Inc. reported unaudited consolidated earnings results for the third quarter and nine months ended September 30, 2009. For the quarter, the company's revenue totaled $23.3 million, a 52% increase compared to $15.3 million for the second quarter of 2009. For the year ago period, revenues were $39 million. During the third quarter of 2009, international sales represented approximately 82% of revenue while domestic sales accounted for 18%. Net loss was $4.8 million or $0.16 per basic and diluted share, compared to a net loss of $0.4 million or $0.01 per basic and diluted share in the year ago period. Operating loss was $5.6 million against $1.2 million a year ago. Non-GAAP operating loss was $3.1 million against operating income of $1.8 million a year ago. Non-GAAP net loss was $2.3 million or $0.07 per basic and diluted share against net income of $1.5 million or $0.05 per basic and diluted share a year ago. For the nine months, the company's revenue was $49.7 million against $114.6 million a year ago. Operating loss was $25.4 million against $7.6 million a year ago. Net loss was $23.5 million or $0.76 per basic and diluted share against $4.1 million or $0.13 per basic and diluted share a year ago. Non-GAAP operating loss was $17.1 million against $306,000 a year ago. Non-GAAP net loss was $14.6 million or $0.48 per basic and diluted share against net income of $620,000 or $0.02 per basic and diluted share a year ago.

Rudolph Technologies Inc. announced that it has received an order for multiple back-end inspection tools from Advanced Semiconductor Engineering Inc. This purchase for automated NSX(R) Inspection Systems with Discover(R) yield management software reflects a trend to incorporate real-time process control into advanced back-end fabrication processes. Rudolph offers a complete line of inspection and metrology systems for semiconductor manufacturing applications. The NSX(R) 115 automated inspection tool is optimized specifically for the back-end manufacturing environment, and offers the highest throughput and greatest flexibility in the detection and analysis of macro defects created during wafer manufacturing, probing, bumping, dicing, or by general handling. The WaferScanner(TM) 3840 uses proprietary laser triangulation technology to provide fast and accurate 3D measurements of bump height and coplanarity. The open architecture and scalable system provided in Discover software can encompass all inspection tools on the fab floor. It is designed to efficiently analyze the tremendous volume of data generated by high-speed inspection tools to identify significant events, such as process excursions, and provide process engineers with the information required to optimize the manufacturing processes.