Cypress Semiconductor Corporation announced three of its CMOS Image Sensors for space applications are on-board the European Space Agency's (ESA) Proba-2 Satellite, which was successfully launched on November 2. Cypress's new HAS2 image sensor, specially designed for high accuracy star tracking, is implemented on a new Star Tracker developed by SELEX Galileo of Italy. The HAS2 image sensor is also being used in an extreme-ultraviolet telescope scientific experiment for solar corona observation. Additionally, Cypress's STAR-250 image sensor is used on a new Digital Sun Sensor developed by TNO of the Netherlands. Both the HAS2 and STAR-250 devices were developed for the ESA by Cypress's Image Sensor Business Unit in Belgium. Cypress also announced commercial availability of the HAS2 image sensor, the latest development in the Cypress STAR family of radiation-tolerant image sensors. The device has an array of 1024 x 1024 active pixels (18 um) and it supports on-chip Non-Destructive Readout and multiple windowing. The HAS2 sensor is qualified for space applications in accordance with the ESA's European Space Components Coordination (ESCC) standards.

Cypress Semiconductor Corporation introduced a high-sensitivity, high-speed CMOS image sensor targeted for the machine vision market. The new 1.3-megapixel VITA 1300 sensor combines a pipelined and triggered global snapshot shutter with a high frame rate of 150 frames-per-second (fps) for undistorted images and fast readout. The pipelined snapshot shutter capability enables exposure during read-out to reduce motion blur. The sensor also works in a rolling shutter mode with Correlated Double Sampling (CDS) to reduce noise and increase dynamic range. The new VITA 1300 family builds on the success of Cypress's IBIS5 imagers in the machine vision market, and also addresses barcode scanning, motion monitoring and security applications. The VITA 1300 sensor offers a 1/2-inch optical format with monochrome or color digital output. The sensor has four 10-bit digital Low Voltage Differential Signaling (LVDS) outputs that enable transfer of image data over a standard industry protocol at low power and low noise. It also has a multiple slope capability to maintain good contrast in shadowed regions without saturating bright areas in scenes with a high contrast ratio. Cypress will demonstrate its custom and standard CMOS image sensor solutions at VISION 2009 in Stuttgart, Germany from November 3-5, in Hall 6, stand C 23.

Cypress Semiconductor Corporation announced a new line of CapSense(R) capacitive touch-sensing devices with low-power 1.8V operation to extend battery life in handheld mobile consumer applications. The CY8C20xx6A devices replace mechanical buttons and sliders, offering attractive, functional interface options for designers. The new family also offers exceptional response time with the most precise scanning of any CapSense devices. With superior immunity to conducted and radiated noise, as well as robust waterproofing, the new devices also enable reliable touch-sensing operation in applications such as white goods, home appliances, printers computers and TVs/monitors. Additionally, the CY8C20xx6A family offers the new patent-pending SmartSense(TM) solution, which automatically calibrates capacitive-sensing parameters during the design process, cutting days of development time. Cypress announced the SmartSense solution in a related release (Cypress's New Auto-Tuning Smart Sense(TM) CapSense(R) Solution Revolutionizes Touch-Sensing Design). The CY8C20xx6A devices have up to 36 general-purpose I/Os (GPIOs) to implement multiple CapSense interfaces. Leveraging the PSoC(R) programmable system-on-chip architecture, a single new CapSense device can also manage functions such as motor control, intelligent sensing, LED control and more--a capability called CapSense Plus(TM). Additionally, the new devices include a full-speed USB interface. The easy-to-use CapSense devices allow customers to bring products to market quickly. The CY8C20xx6A device line is available in multiple configurations and packages, including a small form factor 3x3x0.6-mm 16-pin QFN.